3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility
Wiley - IEEE
1. Edition June 2018
464 Pages, Hardcover
Wiley & Sons Ltd
An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments
* Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility
* Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft's Excel and Minitab
* Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail
* Provides chapter-wise review questions and powerpoint slides as teaching tools
Jason Tzyy-Sheng Horng, National Sun Yat-Sen University, Taiwan, received the B.S.E.E. degree from National Taiwan University, Taipei, Taiwan, in 1985, and the M.S.E.E. and Ph.D. degrees from the University of California at Los Angeles (UCLA), in 1990 and 1992, respectively. Since August 1992, he has been with the Department of Electrical Engineering, National Sun Yat-Sen University (NSYSU), Kaohsiung, Taiwan, where he was the Director of the Telecommunication Research and Development Center (2003 - 2008) and Director of the Institute of Communications Engineering (2004 - 2007), and where he is currently a Professor. He has authored or coauthored over 100 technical publications published in refereed journals and conferences proceedings. He holds over ten patents. His research interests include RF and microwave integrated circuits and components, RF signal integrity for wireless system-in-package, and digitally assisted RF technologies.