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Brockmann, Walter / Geiß, Paul Ludwig / Klingen, Jürgen / Schröder, K. Bernhard
Adhesive Bonding
Materials, Applications and Technology
Übersetzt von Mikhail, Bettina

1. Auflage - November 2008
175,- Euro
2008. XVIII, 414 Seiten, Hardcover
254 Abb. (2 Farbabb.), 33 Tab. 
- Praktikerbuch -
ISBN-10: 3-527-31898-4
ISBN-13: 978-3-527-31898-8 - Wiley-VCH, Weinheim

Preis inkl. Mehrwertsteuer zzgl. Versandkosten.

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Inhalt

Probekapitel

Index



Kurzbeschreibung
Alongside such traditional fields as the properties, chemistry and characteristic behavior of adhesives and adhesive joints, this handbook is the very first to treat in detail current practical questions and the manifold applications for adhesives.

Aus dem Inhalt
POSITION OF ADHESIVE BONDING IN THE FIELD OF JOINING TECHNIQUES
HISTORICAL DEVELOPMENT OD ADHESIVE BONDING
ADHESION
Classical Theories
Chemical Reactions in Boundary Layers
Behavior of Adhesion in Material Compounds
New Aspects in the Field of Adhesion
Conclusions
CHEMISTRY AND PROPERTIES OF ADHESIVES
Pressure Sensitive Adhesives
Contact Adhesives
Hot Melts
Phenolic Adhesives
Epoxy Adhesives
Polyurethane Adhesives
Acrylate Adhesives
Silicone Adhesives
Fillers and Additives
Adhesion Promoters and Primers
DESIGN, PRODUCTION AND QUALITY OF ADHESIVE OINTS
Design of Adhesive Joints under the Aspect of Viscoelastic/ Plastic Behavior of Adhesives
Surface Preparation
Application Systems for Adhesives
Mechanical Properties of Adhesive Joints
Durability of Adhesive Joints
Quality Control
TEST METHODS FOR ADHESIVE JOINTS
Strength Tests
Crash Tests
Ageing Tests
Fracture Analysis
Non Destructive Test Methods
APPLICATION OF ADHESIVE BONDING TECHNOLOGY
Aircraft Industry
Automotive Industry
Railway Industry
Building Industry
Wood Constructions
Paper- and Packing Industry
Electronic Industry
Optical Instruments
Mechanical Engineering
Textile Industry
Road Building
Surface Design
Medicine and Medical Instruments
Adhesive Bonded Joints in the Nature
Arts, Archeology, Jewelry
Adhesive Bonds on Demand
FUTURE TRENDS
Economical Aspects
Technical Aspects
R&D Activities


 
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