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Bücher | Januar 2012 | Handbook of Wafer Bonding
 

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Ramm, Peter / Lu, James Jian-Qiang / Taklo, Maaike M. V. (Hrsg.)
Handbook of Wafer Bonding

1. Auflage Januar 2012
155,- Euro
2012. XXXII, 396 Seiten, Hardcover
253 Abb. (54 Farbabb.), 26 Tab. 
- Handbuch/Nachschlagewerk -
ISBN 978-3-527-32646-4 - Wiley-VCH, Weinheim

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Kurzbeschreibung
Filling a gap for a handbook and reference on recent developments in wafer bonding technology, an author and editor team from microsystems companies and industry-near research organizations presents reliable, first-hand information.

Aus dem Inhalt
TECHNOLOGIES

A. Adhesive and Anodic Bonding

Glass Frit Wafer Bonding
Wafer Bonding Using Spin-On Glass as Bonding Material
Polymer Adhesive Wafer Bonding
Anodic Bonding

B. Direct Wafer Bonding

Direct Wafer Bonding
Plasma-Activated Bonding

C. Metal Bonding

Au/Sn Solder
Eutectic Au-In Bonding
Thermocompression Cu-Cu Bonding of Blanket and Patterned Wafers
Wafer-Level Solid-Liquid Interdiffusion Bonding

D. Hybrid Metal/Dielectric Bonding

Hybrid Metal/Polymer Wafer Bonding Platform
Cu/SiO2 Hybrid Bonding
Metal/Silicon Oxide Hybrid Bonding

APPLICATIONS

Microelectromechanical Systems
Three-Dimensional Integration
Temporary Bonding for Enabling Three-Dimensional Integration and Packaging
Temporary Adhesive Bonding with Reconfiguration of Known Good Dies for Three-Dimensional Integrated Systems
Thin Wafer Support System for above 250°C Processing and Cold De-bonding
Temporary Bonding: Electrostatic

 





 

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