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Short description Filling a gap for a handbook and reference on recent developments in wafer bonding technology, an author and editor team from microsystems companies and industry-near research organizations presents reliable, first-hand information.
From the contents TECHNOLOGIES
A. Adhesive and Anodic Bonding
Glass Frit Wafer Bonding Wafer Bonding Using Spin-On Glass as Bonding Material Polymer Adhesive Wafer Bonding Anodic Bonding
B. Direct Wafer Bonding
Direct Wafer Bonding Plasma-Activated Bonding
C. Metal Bonding
Au/Sn Solder Eutectic Au-In Bonding Thermocompression Cu-Cu Bonding of Blanket and Patterned Wafers Wafer-Level Solid-Liquid Interdiffusion Bonding
Microelectromechanical Systems Three-Dimensional Integration Temporary Bonding for Enabling Three-Dimensional Integration and Packaging Temporary Adhesive Bonding with Reconfiguration of Known Good Dies for Three-Dimensional Integrated Systems Thin Wafer Support System for above 250°C Processing and Cold De-bonding Temporary Bonding: Electrostatic
