Wiley-VCH - Pecht, Michael (ed.) - Soldering Processes and Equipment

Shopping cart

	Books \| Mechanical Engineering \| Mechanical Engineering - Design \| Soldering Processes and Equipment

Browse our products:

	Just published
	Productsearch
	Featured sites

Choose your area of interest:

	Resources for:
	Authors
	Librarians
	Booksellers
	Journalists
	Advertisers
	Business Customers
	Lecturers
	Licenses

ChemistryViews

MaterialsViews

wileyPLUS

WileyOnline Library

Wiley JobNetwork

Wiley STMData

Ernst & Sohn

Pecht, Michael (ed.) Soldering Processes and Equipment July 1993 142.- Euro 1993. 312 Pages, Hardcover ISBN 978-0-471-59167-2 - John Wiley & Sons
Buy now

Detailed description Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. Features techniques to assure reliability and quality control during the manufacturing process and emphasizes the importance of rework in the soldering industry. From the contents Solders, Solder Fluxes, and Solder Pastes. Wave Soldering. Reflow Soldering. Cleaning and Contamination. Reliability and Quality. Rework, Repair, and Manual Assembly. Appendix. Glossary of Soldering Terms. Index.

	Detailed description
	Author affiliation

Related Books
	Multibody Dynamics with Unilateral Contacts The Engineering of Human Joint Replacements Computer Architecture and Security Fundamentals of Designing Secure Computer Systems
	[more >>]

Related Journals
	PAMM ZAMM
[more>>]

Special Offers
	Bobzin, Kirsten Oberflächentechnik für den Maschinenbau 59.- Euro valid until 30 September 2013
	[more offers >>]

Tell a friend RSS Feeds Print-Version Sitemap

©2013 Wiley-VCH Verlag GmbH & Co. KGaA - Provider
http://www.wiley-vch.de - mailto: info@wiley-vch.de
Data Protection