Sensors Applications

Sensors Applications series is designed to meet the need for comprehensive information on the potential - and limits - of sensors applications in specific industry segments. The series has been developed with scientists and engineers in mind who are involved in research and development of sensors as well as their applications. Providing a high level of detailed, up-to-date information, it will be equally useful for sensors experts in academia and industry, as well as for graduate and postgraduate students.

Each volume will focus on sensors applications in a major industry. Starting with Sensors in Manufacturing and Sensors in Intelligent Buildings, further volumes will cover sensors applications in areas such as medicine and health care, automotive technology, aerospace technology, environmental engineering, and household appliances. Expansion of the series is not unlikely as sensors make their way into our everyday lives as well as into the most advanced research applications.
 

Sensors in Manufacturing  Edited by: H. K. Tönshoff, Institut für Fertigungstechnik, Universität Hannover, Germany and I. Inasaki, Faculty of Science and Technology, Keio University, Japan ISBN 3-527-29558-5 Due: February 2001 426 pages, 312 fig., 18 tabs. With contributions by: C.-D. Bouzakis, Aristoteles University Thessaloniki, Greece E. Brinksmeier, Universität Bremen, Germany E. Doege, Universität Hannover, Germany D. Dornfeld, University of California, Berkeley, USA G. Erkens, CemeCon GmbH, Aachen, Germany H. D. Haferkamp, Universität Hannover, Germany O. Hillers, Laser Zentrum Hannover e.V., Germany I. Inasaki, Keio University, Yokoshama-shi, Japan B. Karpuschewski, Keio University, Yokoshama-shi, Japan F. Klocke, RWTH Aachen, Germany H. Klümper-Westkamp, Institut für Werkstofftechnik, Bremen Germany V. Kral, Laser Zentrum Hannover e.V., Germany P. Mayr, Institut für Werkstofftechnik, Bremen, Germany T. Masuzawa, University of Tokyo, Japan T. Moriwaki, Kobe University, Japan M. Niemeyer, Universität Hannover, Germany A. Ostendorf, Laser Zentrum Hannover e.V., Germany H. K. Tönshoff, Universität Hannover, Germany J. Weber, Universität Hannover, Germany M. Weck, RWTH Aachen, Germany A. Weckenmann, Universität Erlangen-Nürnberg, Germany R. Wertheim, ISCAR Ltd. Hardmetal Ind. Products, Tefen, Israel

Sensors in Manufacturing deals with monitoring techniques in various manufacturing processes. Machine tools that operate at high speed or are applied for ultra-precision manufacturing are only two examples to show how manual control has been supported or even replaced by integrated sensors. The present book aims at providing the latest developments in sensors for quality control or prevention of machine failure. Although concentrating on the practical application of sensors, it also provides the reader with the necessary basic principles.  From the contents: 1. Fundamentals Roles of sensors in manufacturing and application ranges  Principles of Sensors in Manufacturing  Sensors in Manufacturing - Requirements, demands, boundary conditions  Signal Processing  2. Sensors for machine tools and robots Position measurement  Sensors for orientation  Calibration of machine tools and robots  Collision detection  Machine tool monitoring and diagnosis  3. Sensors for Workpieces Macro-geometric features  Micro-geometric features  Sensors for physical properties  4. Sensors for process monitoring Casting  Powder-metallurgy  Metal forming  Cutting  Abrasive processes  Laser processing  Electrical discharge machining  Welding  Coating  Heat treatment  5. Developments in manufacturing and their influences on sensors Ultra-precision machining  High-speed machining  Micro machining  Environmental consciousness

Sensors in Intelligent Buildings  Edited by: O. Gassmann, Schindler Elevators Corp., Ebikon, Switzerland; H. Meixner, Siemens AG, Munich, Germany ISBN 3-527-29557-7 Due: April 2001 610 pages, 450 fig., 50 tabs. With contributions by: Dr. M. Barnard, Philips Research Laboratories Dr. M. Bauer, Estial Sárl Dr. T. Bernard, Fraunhofer Institute for Information and Data Processing Dr. J. Bichsel, Sauter Lars Binternagel, Technical University of Munich Dr. C. Busch, Fraunhofer Institute for Computer Graphics Research Prof. D. Dietrich, Vienna University of Technology  Dr. H.-E. Endres, Fraunhofer Institute of Microelectric Circuits and Systems P. Fischer, Dortmund University of Applied Sciences Prof. P. L. Fuhr, San Josè State University Dr. O. Gassmann, Schindler Elevators & Escalators Dr. A. Hamdy, Transtechno Prof. B. J. Hosticka, Fraunhofer Institute of Microelectronic Circuits and Systems Prof. D. R. Huston, University of Vermont J. Kahn, Siemens Energy and Automation O. Kanoun, University of the Federal Armed Forces Munich J. Krauss, Swiss Center for Electronic and Microtechnology R. Kunz, Schindler Elevators & Escalators Dr. H.-B. Kuntze, Fraunhofer Institute for Information and Data Processing Y. Kyselytsya, Technical University of Munich D. Loy, Coactive Networks Y. Lüthi, Siemens Landis & Staefa E. Marchesi, Schindler Elevators & Escalators R. Meisinger, Siemens Building Technologies Prof. Dr. H. Meixner, Siemens Corporate Technology K. Mnif, Motorola Dr. N. Morel, Swiss Federal Institute of Technology D. Mrozinski, Siemens Landis & Staefa Dr.-Ing. G. Mügge, Viterra Energy Services W. Müller, Technical University of Munich A. Pentland, The Media Laboratory Massachusetts Institute of Technology Dr. G. Pfister, Siemens Building Technologies R. Reinema, German National Research Center for Information Technology Prof. Dr. P. Ryser, Swiss Federal Institute of Technology  Th. Sauter, Vienna University of Technology Prof. Dr. Ing. F. Schneider, Technical University of Munich T. Schlütsmeier, Technical University of Munich B. Schreyer, Technical University of Munich L. A. Slivovsky, Purdue University R. Stolyar, Technical University of Munich Dr. A. So, City University of Hong Kong Prof. Dr. H. Z. Tan, Purdue University M. Thuillard, Siemens Building Technologies  Prof. Dr. H.-R. Tränkler, University of the Federal Armed Forces Munich W. L. Tse, City University of Hong Kong T. Weinzierl, Weinzierl Engineering M. Wenzler, Siemens Building Technologies K. Werthschulte, Technical University of Munich G. Westermeir, Technical University of Munich D. Wölfle, Technical University of Munich

Sensors in Intelligent Buildings provides engineers and scientists with a competent and comprehensive survey on the sensors currently applied in the building industry. This book not only presents the different types of sensors for energy efficiency, life safety, maintenance management or smart house devices. It also discusses the sensors' strengths and weaknesses and illustrates which sensor is used in which subsystem and for what reasons.  From the contents: 1. Introduction Sensors in Intelligent Buildings: Overview and Trends  2. Energy and HVAC Intelligent Air-Conditioning Control  Neurobat - a Self-Commissioned Heating Control System  Air Quality Measurement and Management  Sensor-Based Management of Energy and Thermal Comfort  Wireless and M-Bus Enabled Metering Devices  Sensors in HVAC-Systems for Metering and Energy Cost Allocation  Pressure Sensors in the HVAC Industry  3. Information and Transportation Fieldbus Systems  Wireless In-Building Networks  Sensor Systems in Modern High-Rise Elevators  Sensing Chair and Floor using Distributed Contact Sensors  4. Safety and Security Life Safety and Security Systems  Biometrica Authentication for Access Control  Smart Cameras for Intelligent Buildings  Load Sensing for Improved Construction Site Safety  5. Maintenance and Facility Management Maintenance Management in Industrial Installations  WWFM - World Wide Facility Management  6. System Technologies Sensor Systems in Intelligent Buildings  System Technologies for Private Homes