# Introduction to Electromagnetic Compatibility

3. Auflage November 2022

848 Seiten, Hardcover*Lehrbuch*

**978-1-119-40434-7**

INTRODUCTION TO ELECTROMAGNETIC COMPATIBILITY

The revised new edition of the classic textbook is an essential resource for anyone working with today's advancements in both digital and analog devices, communications systems, as well as power/energy generation and distribution.

Introduction to Electromagnetic Compatibility provides thorough coverage of the techniques and methodologies used to design and analyze electronic systems that function acceptably in their electromagnetic environment. Assuming no prior familiarity with electromagnetic compatibility, this user-friendly textbook first explains fundamental EMC concepts and technologies before moving on to more advanced topics in EMC system design.

This third edition reflects the results of an extensive detailed review of the entire second edition, embracing and maintaining the content that has "stood the test of time", such as from the theory of electromagnetic phenomena and associated mathematics, to the practical background information on U.S. and international regulatory requirements. In addition to converting Dr. Paul's original SPICE exercises to contemporary utilization of LTSPICE, there is new chapter material on antenna modeling and simulation. This edition will continue to provide invaluable information on computer modeling for EMC, circuit board and system-level EMC design, EMC test practices, EMC measurement procedures and equipment, and more such as:

* Features fully-worked examples, topic reviews, self-assessment questions, end-of-chapter exercises, and numerous high-quality images and illustrations

* Contains useful appendices of phasor analysis methods, electromagnetic field equations and waves.

The ideal textbook for university courses on EMC, Introduction to Electromagnetic Compatibility, Third Edition is also an invaluable reference for practicing electrical engineers dealing with interference issues or those wanting to learn more about electromagnetic compatibility to become better product designers.

1 Introduction to Electromagnetic Compatibility (EMC) 1

1.1 Aspects of EMC 2

1.2 Electrical Dimensions and Waves 9

1.3 Decibels and Common EMC Units 16

1.4 Summary 30

2 EMC Requirements for Electronic Systems 35

2.1 Governmental Requirements 36

2.2 Additional Product Requirements 62

2.3 Design Constraints for Products 63

2.4 Advantages of EMC Design 64

3 Signal Spectra--the Relationship between the Time Domain and the Frequency Domain 71

3.1 Periodic Signals 71

3.2 Spectra of Digital Waveforms 93

3.3 Spectrum Analyzers 113

3.4 Representation of Nonperiodic Waveforms 118

3.5 Representation of Random (Data) Signals 121

4 Transmission Lines and Signal Integrity 133

4.1 The Transmission-Line Equations 136

4.2 The Per-Unit-Length Parameters 139

4.3 The Time-Domain Solution 155

4.4 High-Speed Digital Interconnects and Signal Integrity 170

4.5 Sinusoidal Excitation of the Line and the Phasor Solution 192

4.6 Lumped-Circuit Approximate Models 210

5 Nonideal Behavior of Components 221

5.1 Wires 222

5.2 Printed Circuit Board (PCB) Lands 232

5.3 Effect of Component Leads 235

5.4 Resistors 237

5.5 Capacitors 243

5.6 Inductors 251

5.7 Ferromagnetic Materials--Saturation and Frequency Response 255

5.8 Ferrite Beads 258

5.9 Common-Mode Chokes 261

5.10 Electromechanical Devices 264

5.11 Digital Circuit Devices 269

5.12 Effect of Component Variability 270

5.13 Mechanical Switches 270

6 Conducted Emissions and Susceptibility 287

6.1 Measurement of Conducted Emissions 288

6.2 Power Supply Filters 294

6.3 Power Supplies 310

6.4 Power Supply and Filter Placement 319

6.5 Conducted Susceptibility 321

7 Antennas 325

7.1 Elemental Dipole Antennas 325

7.2 The Half-Wave Dipole and Quarter-Wave Monopole Antennas 332

7.3 Antenna Arrays 342

7.4 Characterization of Antennas 349

7.5 The FRIIs Transmission Equation 365

7.6 Effects of Reflections 368

7.7 Broadband Measurement Antennas 381

7.8 Antenna Modeling and Simulation 388

8 Radiated Emissions and Susceptibility 397

8.1 Simple Emission Models for Wires and PCB Lands 398

8.2 Simple Susceptibility Models for Wires and PCB Lands 423

9 Crosstalk 445

9.1 Three-Conductor Transmission Lines and Crosstalk 446

9.2 The Transmission-Line Equations for Lossless Lines 449

9.3 The Per-Unit-Length Parameters 452

9.4 The Inductive--Capacitive Coupling Approximate Model 476

9.5 Shielded Wires 500

9.6 Twisted Wires 529

10 Shielding 557

10.1 Shielding Effectiveness 561

10.2 Shielding Effectiveness: Far-Field Sources 563

10.3 Shielding Effectiveness: Near-Field Sources 576

10.4 Low-Frequency, Magnetic Field Shielding 581

10.5 Effects of Apertures 585

11 System Design for EMC 593

11.1 Changing the Way we Think About Electrical Phenomena 597

11.2 What do we Mean by the Term "Ground" 605

11.3 Printed Circuit Board (PCB) Design 636

11.4 System Configuration and Design 655

11.5 Diagnostic Tools 672

Appendix A The Phasor Solution Method 683

A.1 Solving Differential Equations for their Sinusoidal, Steady-State Solution 683

A.2 Solving Electric Circuits for Their Sinusoidal, Steady-State Response 687

Appendix B The Electromagnetic Field Equations and Waves 693

B.1 Vector Analysis 694

B.2 Maxwell's Equations 701

B.3 Boundary Conditions 720

B.4 Sinusoidal Steady State 724

B.5 Power Flow 725

B.6 Uniform Plane Waves 726

B.7 Static (DC) Electromagnetic Field Relations--a Special Case 741

Appendix C Computer Codes for Calculating the Per-Unit-Length (PUL) Parameters and Crosstalk of Multiconductor Transmission Lines 753

C.1 WIDESEP.FOR for Computing the PUL Parameter Matrices of Widely Spaced Wires 754

C.2 RIBBON.FOR for Computing the PUL Parameter Matrices of Ribbon Cables 758

C.3 PCB.FOR for Computing The PUL Parameter Matrices of Printed Circuit Boards 760

C.4 MSTRP.FOR for Computing the PUL Parameter Matrices of Coupled Microstrip Lines 761

C.5 STRPLINE.FOR for Computing the PUL Parameter Matrices of Coupled Striplines 762

Appendix D A Spice (PSPICE, LTSPICE, etc.) Tutorial and Applications Guide 765

D.1 Creating a Spice or Pspice Simulation 766

D.2 Creating an Ltspice Simulation 777

D.3 Lumped-Circuit Approximate Models 785

D.4 An Exact Spice (Pspice) Model for Lossless, Coupled Lines 788

D.5 Use of Spice (Pspice) in Fourier Analysis 805

D.6 Spicemtl.For for Computing a Spice (Pspice) Subcircuit Model of a Lossless, Multiconductor Transmission Line 815

D.7 Spicelpi.For for Computing a Spice (Pspice) Subcircuit of a Lumped-Pi Model of a Lossless, Multiconductor Transmission Line 817

Problems 818

References 820

Appendix E A Brief History of Electromagnetic Compatibility 823

E.1 History of EMC 823

E.2 Examples 825

Index 827

Robert C. Scully a Principal Electromagnetic Compatibility Engineer, practicing at Jet Propulsion Laboratory (JPL) in Pasadena, CA., previously the Johnson Space Center (JSC) Electromagnetic Compatibility Group Lead Engineer for 20 years. He earned his PhD in Electrical Engineering from the University of Texas at Arlington, USA, and is a Fellow of the IEEE. At JSC, he supported NASA's major space programs including the Space Shuttle, the International Space Station, the Multi-Purpose Crew Vehicle, the Commercial Crew Development Program, and the Gateway Program. At JPL he is currently supporting development of major satellite projects including NISAR and Europa.

Mark A. Steffka is a Professor at the University of Detroit-Mercy. He joined the Electrical and Computer Engineering department as a full-time faculty member after his retirement from General Motors, where spent 20 years in the EMC Group. He received his B.S.E.E. from the University of Michigan and his M.S. from Indiana Wesleyan University. He has over 35 years' experience in the design, development, and testing of military communication systems, aerospace instrumentation, automotive electrical/electronic systems, and vehicle antennas. Steffka is a Senior Member of the IEEE and has co-authored / authored many publications on EMC, Radio Frequency Interference and more.