Wiley-VCH - Steigerwald, Joseph M. / Murarka, Shyam P. / Gutmann, Ronald J. - Chemical Mechanical Planarization of Microelectronic Materials

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Ernst & Sohn

Steigerwald, Joseph M. / Murarka, Shyam P. / Gutmann, Ronald J. Chemical Mechanical Planarization of Microelectronic Materials 1. Edition February 1997 142.- Euro 1997. XIII, 324 Pages, Hardcover 181 Fig. - Monograph - ISBN 978-0-471-13827-3 - Wiley-VCH, Berlin
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Short description This book covers the chemical and mechanical polishing techniques of electronic materials used in the microelectronics industry to improve the electronic properties of materials such as oxide. From the contents Chemical Mechanical Planarization-An Introduction. Historical Motivations for CMP. CMP Variables and Manipulations. Mechanical and Electrochemical Concepts for CMP. Oxide CMP Process-Mechanisms and Models. Tungsten and CMP Processes. Copper CMP. CMP of Other Materials and New CMP Applications. Post-CMP Cleanup. Appendix. Index.

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