|  | Tabata, Osamu / Tsuchiya, Toshiyuki (Hrsg.)
Reliability of MEMS
Testing of Materials and Devices
Advanced Micro and Nanosystems (Band 6)
Herausgegeben von Brand, Oliver / Fedder, Gary K. / Hierold, Christofer / Korvink, Jan G.
 1. Auflage - Dezember 2007
215,- Euro*
2007. XX, 304 Seiten, Hardcover
204 Abb., 25 Tab.
- Handbuch/Nachschlagewerk -
ISBN-10: 3-527-31494-6
ISBN-13: 978-3-527-31494-2 - Wiley-VCH, Weinheim
Preis inkl. Mehrwertsteuer zzgl. Versandkosten.
* Serienpreis auf Anfrage bei service@wiley-vch.de
Probekapitel
Kurzbeschreibung
The first book to cover exclusively and in detail the principles, tools and methods for determining the reliability of MEMS microelectromechanical materials, components and devices. As such, it covers both component materials as well as entire MEMS devices.
Aus dem Inhalt
Evaluation of Mechanical Properties of MEMS Materials and their Standardization
Elastoplastic Indentation Contact Mechanics of Homogeneous Materials and Coating-Substrate Systems
Thin-film Characterization Using the Bulge Test
Uniaxial Tensile Test for MEMS Materials
On-chip Testing of MEMS
Reliability of a Capacitive Pressure Sensore
Inertial Sensors
High-accuracy, High-reliability MEMS Accelerometer
Reliability of MEMS Variable Optical Attenuator
Eco Scan MEMS Resonant Mirror
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