1. Auflage - Februar 1997
125,- Euro
1997. XIII, 324 Seiten, Hardcover
181 Abb.
- Monographie -
ISBN-10: 0-471-13827-4
ISBN-13: 978-0-471-13827-3 - Wiley-VCH, Berlin

Preis inkl. Mehrwertsteuer zzgl. Versandkosten.







Kurzbeschreibung
This book covers the chemical and mechanical polishing techniques of electronic materials used in the microelectronics industry to improve the electronic properties of materials such as oxide.

Aus dem Inhalt
Chemical Mechanical Planarization-An Introduction.

Historical Motivations for CMP.

CMP Variables and Manipulations.

Mechanical and Electrochemical Concepts for CMP.

Oxide CMP Process-Mechanisms and Models.

Tungsten and CMP Processes.

Copper CMP.

CMP of Other Materials and New CMP Applications.

Post-CMP Cleanup.

Appendix.

Index.