CMOS-MEMS

1. Auflage April 2013
XII, 596 Seiten, Softcover
312 Abbildungen
32 Tabellen
Praktikerbuch
Kurzbeschreibung
This edition of "CMOS-MEMS" was originally published in the successful series "Advanced Micro & Nanosystems". It examines the various routes and methods to combine electronics generated by the CMOS technology with novel micromechanical parts.
This edition of 'CMOS-MEMS' was originally published in the successful series 'Advanced Micro & Nanosystems'. Here, the combination of the globally established, billion dollar chip mass fabrication technology CMOS with the fascinating and commercially promising new world of
MEMS is covered from all angles.
The book introduces readers to this fi eld and takes them from fabrication technologies and material charaterization aspects to the actual applications of CMOS-MEMS - a wide range of miniaturized physical, chemical and biological sensors and RF systems. Vital knowledge on circuit and system integration issues concludes this in-depth treatise, illustrating the advantages of combining CMOS and MEMS in the first
place, rather than having a hybrid solution.
Material Characterization
Monolithically Integrated Inertial Sensors
CMOS?MEMS Acoustic Devices
RF CMOS MEMS
CMOS-based Pressure Sensors
CMOS-based Chemical Sensors
Biometric Capacitive CMOS Fingerprint Sensor Systems
CMOS-based Biochemical Sensing Systems
CMOS-based Thermal Sensors
Circuit and System Integration
Gary K. Fedder is Professor of Electrical and Computer Engineering, Professor of The Robotics Institute and the Director of the Institute for Complex Engineered Systems (ICES) at Carnegie Mellon University, Pittsburgh, USA. He received the BSc and MSc degrees in electrical engineering from MIT in 1982 and 1984, respectively, and his PhD in 1994 from the University of California, Berkeley. His research interests include microelectromechanical systems (MEMS) modeling, simulation and synthesis, integration of MEMS and CMOS, microsensor design, microactuator control systems, and probe-based nanofabrication technologies.