Wiley-VCH, Weinheim Functional Polyimide Dielectrics Cover A systematic and comprehensive description of the most up-to-date research advance of polyimides die.. Product #: 978-3-527-35433-7 Regular price: $129.91 $129.91 Auf Lager

Functional Polyimide Dielectrics

Structure, Properties, and Applications

Zha, Jun-Wei (Herausgeber)

Cover

1. Auflage April 2025
304 Seiten, Hardcover
11 Abbildungen (8 Farbabbildungen)
Handbuch/Nachschlagewerk

ISBN: 978-3-527-35433-7
Wiley-VCH, Weinheim

Kurzbeschreibung

A systematic and comprehensive description of the most up-to-date research advance of polyimides dielectrics in the field of electrical and electronic engineering.

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Chapter 1 Overview of Polyimide Dielectrics
Chapter 2 Structures and Properties of Polyimide Dielectric Materials
Chapter 3 Processing Technology of Polyimide Dielectrics: From Experimental to Industrial Scale
Chapter 4 Polyimide Dielectrics for High Temperature Energy Storage
Chapter 5 Polyimide Dielectrics for High Temperature Energy Storage
Chapter 6 High Thermal Conductive Polyimide Dielectrics
Chapter 7 Polyimide Dielectrics for Electromagnetic Interference Shielding
Chapter 8 Colorless Transparent Polyimides with Balanced Dielectric and Optical Properties
Chapter 9 Polyimide dielectrics in extreme environment
Chapter 10 Smart Polyimide Dielectrics
Jun-Wei Zha is currently the Professor at University of Science and Technology Beijing, China. He received the PhD degree from the Beijing University of Chemical Engineering, Beijing, China in 2010. He studied as Jiont-Ph.D in the Electrical Power Engineering at University of Southampton (Sponsored by CSC) from 2009 to 2010. He worked as Senior Associate Researcher in the Department of Physics and Materials Science at City University of Hong Kong (CityU) from 2013 to 2014. He was selected as ?Hong Kong Scholar? and worked at CityU from 2014 to 2016. He also won the first prize of Natural Science of the Ministry of Education in 2019 and Young Scientist Award of Chinese Society for Composite Materials in 2021.