John Wiley & Sons From LED to Solid State Lighting Cover A comprehensive reference including practical, hands-on exercises and data of experimental studies, .. Product #: 978-1-118-88147-7 Regular price: $114.02 $114.02 Auf Lager

From LED to Solid State Lighting

Principles, Materials, Packaging, Characterization, and Applications

Lee, S. W. Ricky / Lo, Jeffery C. C. / Tao, Mian / Ye, Huaiyu

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1. Auflage Oktober 2021
256 Seiten, Hardcover
Wiley & Sons Ltd

ISBN: 978-1-118-88147-7
John Wiley & Sons

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A comprehensive reference including practical, hands-on exercises and data of experimental studies, written by leading researchers in the field

* An introductory/intermediate level treatment including practical, hands-on exercises and data of experimental studies, written by leading researchers in the field
* The authors lead a LED packaging R&D center with an industrial grade prototyping line and state-of-the-art facilities for materials/optical/electrical/thermal characterization. A substantial amount of technical contents in this book is based on the hands-on experience and experimental practices of the authors
* The manufacture of LED-based luminaries for lighting is a huge area and there is a need for a comprehensive book instructing engineers and designers in the lighting industry
* Includes packaging LED components such as interconnection, phosphor deposition, encapsulation, thermal management and reliability, making this an excellent reference and background reading for engineers and researchers

Preface ix

About the Authors xi

1 LED for Solid-State Lighting 1

1.1 Introduction 1

1.2 Evolution of Light Sources and Lighting Systems 2

1.3 Historical Development of LED 4

1.4 Implementation of White Light Illumination with LED 6

1.5 LED for General Lighting 8

References 9

2 Packaging of LED Chips 11

2.1 Introduction 11

2.2 Overall Packaging Process and LED Package Types 12

2.2.1 PTH LED Component 13

2.2.2 SMD LED Component 14

2.3 Chip Mounting and Interconnection 16

2.3.1 Die Attach Adhesive 17

2.3.2 Soldering and Eutectic Bonding 21

2.3.3 Wire Bonding 26

2.3.4 Flip Chip 29

2.4 Phosphor Coating and Dispensing Process 33

2.4.1 Dispersed Dispensing 34

2.4.2 Conformal Coating 37

2.4.3 Remote Phosphor 41

2.5 Encapsulation and Molding Process 43

2.5.1 Encapsulant Filling with Lens 43

2.5.2 Lens Molding 44

2.6 Secondary Optics and Lens Design 45

References 48

3 Chip Scale and Wafer Level Packaging of LED 53

3.1 Introduction 53

3.2 Chip Scale Packaging 55

3.3 Enabling Technologies for Wafer Level Packaging 58

3.3.1 Photolithography 58

3.3.2 Wafer Etching 61

3.3.3 TSV Filling 64

3.3.4 Bond Pad Metallization 66

3.3.5 Wafer Level Phosphor Deposition Methods 68

3.3.6 Moldless Encapsulation 78

3.4 Designs and Structures of LED Wafer Level Packaging 82

3.5 Processes of LED Wafer Level Packaging 86

References 96

4 Board Level Assemblies and LED Modules 99

4.1 Introduction 99

4.2 Board Level Assembly Processes 100

4.2.1 Metal Core Printed Circuit Board 100

4.2.2 Printed Circuit Board with Thermal Vias 107

4.2.3 Wave Soldering 112

4.2.4 Surface Mount Reflow 114

4.3 Chip on Board Assemblies 118

4.4 LED Modules and Considerations 124

References 127

5 Optical, Electrical, and Thermal Performance 131

5.1 Evaluation of Optical Performance 131

5.1.1 Basic Concepts about Radiometric and Photometric 131

5.1.2 Irradiance Measurement Calibration 140

5.1.3 Common Measurement Equipment 141

5.2 Power Supply and Efficiency 144

5.2.1 Electrical characteristic of LED 145

5.2.2 Power supply for LED 146

5.2.3 Power efficiency 147

5.3 Consideration of LED Thermal Performance 148

5.3.1 Thermal characterization methods for LED 148

5.3.2 Thermal management methods 155

Reference 156

6 Reliability Engineering for LED Packaging 159

6.1 Concept of Reliability and Test Methods 160

6.1.1 Reliability of electronic components or system 160

6.1.2 Common failure mechanisms and reliability tests 161

6.2 Failure Analysis and Life Assessment 165

6.2.1 Methodology for failure analysis 165

6.2.2 Weibull analysis and acceleration model for life assessment 166

6.3 Design for Reliability 169

References 171

7 Emerging Applications of LED 173

7.1 LED for Automotive Lighting 173

7.1.1 Development 173

7.1.2 Typical structures 174

7.1.3 Challenges 175

7.1.4 Conclusion 178

7.2 Micro and Mini LED Display 178

7.2.1 Development 179

7.2.2 Typical structures 184

7.2.3 Challenges 186

7.2.4 Conclusion 186

7.3 LED for Visible Light Communications 187

7.3.1 Development 188

7.3.2 Typical applications 189

7.3.3 Challenges 190

7.3.4 Conclusion 191

References 192

8 LED beyond Visible Light 197

8.1 Applications of UV LED 197

8.1.1 Structures 198

8.1.2 Applications 201

8.1.3. Challenges 204

8.1.4 Conclusion 208

8.2 Applications of IR-LED 208

8.2.1 Structures 209

8.2.2 Applications 210

8.2.3 Challenges 214

8.2.4 Conclusion 215

8.3 Future Outlook and Other Technology Trends 216

8.3.1 Better light source 216

8.3.2 Interconnection 217

8.3.3 Interaction with human 218

8.3.4 Light on demand 219

References 219